Semi-automatic wafer probing

Wafer testing for failure analysis and IC development requires sometimes repeating the probing operation several times on different dies. To accelerate this process and avoid having to move the probers on the pads of the next die, a positioning stage is used to move the wafer while keeping the probers fixed. The 2 degree of freedom positioning stage is an option of the miBase and has a range of motion of 13x13mm. Learn more about the positioning stage.