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Deposition and in-situ measurement of a 1kOhm pull-up resistor at FIB angle tilt position

When developing a new Integrated Circuit (IC), failures can arise after the first tests. Circuit editing is a powerful technique which allows to rapidly modify this IC and debug it without having to prepare new masks. Among these modifications, the deposition of a precise resistor between two nodes of a circuit is a common practice.

In this article, we report the in-situ measurement of a resistor’s value while it is being created with FIB induced Platinum deposition. The simultaneous deposition and resistor measurement were performed under a stage tilt angle of 54°.

As the stage was brought to the correct tilted angle, the two nanoprobers from Imina Technologies were connected to both terminals of the resistor to be deposited. The resistance was monitored during deposition and used as an end-point detection when the desired value was reached.

Being able to accurately landing probes and keeping steady electrical contacts over the time, while the sample stage of the electron microscope is tilted, are making the miBot™ the ideal probing tool for circuit editing.

Experiment realized at

Fraunhofer CAM, Halle, Germany


W. Courbat and J. Jatzkowski, “Faster and More Accurate Failure Analysis: Circuit Editing and Short Localization Performed at Same FEB Tilt Angle using Multiple Techniques”, Electronic Device Failure Analysis, 21(4), p. 22-28, 2019.

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Imina Technologies' application engineer shows a colleague how to land probes on nanoscale contacts for in-situ SEM transistor characterization.