From Nov. 16 to 20, 2025 in Pasadena, CA, USA
The 51st International Symposium for Testing and Failure Analysis (ISTFA) will explore cutting-edge topics such as the challenges and solutions in heterogeneous integration, advanced packaging techniques, and the role of failure analysis in ensuring the reliability of next-generation microelectronics. Participants can expect to gain valuable perspectives on how to navigate the complexities of these advanced technologies, enabling them to drive innovation in their respective fields.
Meet us at booth #507 with our distributor Angstrom Scientific Inc. (booth #509).
