Park Systems and Imina Technologies released an integrated platform for high-resolution AFM-based nano-imaging with multi-electrode electrical contact for real-time biasing.
Researchers working with 2D materials, layered-material heterostructures, and thin-film electronic devices often rely on advanced AFM modes to study local electrical and thermal behavior. Techniques such as KPFM, C-AFM, and SThM become especially powerful when combined with source-drain biasing or controlled current injection.
The integrated setup combines the Park Systems FX200 AFM with up to four Imina miBots mounted directly on the sample chuck. Each miBot carries a tungsten probe that can be positioned independently in the region of interest without interfering with the AFM cantilever, enabling stable electrical contact while preserving high-resolution AFM imaging conditions.
The application note showcasing the integration demonstrates several use cases:
- Electrical contact with individual 2D-material flakes enables single-pass KPFM and C-AFM measurements on samples that would otherwise be electrically floating.
- Interface characterization of 2D layers before they are buried in later fabrication steps without the need for fabricating contacts and verification of the registry of layers in heterostructures.
- On UV-ozone-treated MoS₂ devices, in-operando KPFM under source–drain bias is used to map the voltage-drop distribution along the channel and extract insight into contact resistance and device behavior.
- SThM measurements with controlled DC current injection allow researchers to visualize Joule-heating hotspots in nano-structured devices.
Read the full application note from Park Systems to learn about the integrated setup and the examples in more detail.